rasdaman newsletter 07/2019
rasdaman Receives US TechConnect Innovation Award
Boston, June 2019 - Every year, the innovation award is a highlight of the TechConnect event in Boston, USA. This year, the rasdaman datacube technology received the prestigious award from the industry prospectors looking for breakthrough technologies.
The TechConnect Innovation Awards identify the top 15% of submitted technologies as ranked by the TechConnect Corporate & Investment Partner Committee. Innovation rankings are based on the impact the submitted technology will have on a specific industry sector. Innovations are submitted globally, ranging from academia over government and corporate research laboratories to small and large industry.
"We are proud about this leadership acknowledgement expressed by TechConnect Boston", says Peter Baumann, Principal Architect of rasdaman and CEO. "The continuous line of innovation awards, such as the NITEC Innovation Award 2018, is a strong incentive for the team to maintain its strong pace of innovation."
For over 20 years the TechConnect World Innovation Conference and Expo has connected top applied research and early-stage innovations from universities, labs, and startups with industry end-users and prospectors. TechConnect has published over 10,000 technical papers, connected over 20,000 innovations with industry partners, provided prospecting to most all Fortune 500 technology companies, and supported most every U.S. Science and Technology agency since its inception.
More information: TechConnect Innovation Awardee